Madhavan Swaminathan received his B.E. in electronics and communication from Regional Engineering College, Tiruchirapalli, in 1985, and his M.S. and Ph.D. in electrical engineering from Syracuse University in 1989 and 1991. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and deputy director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Before joining Georgia Tech, he worked on packaging for supercomputers for IBM. Swaminathan has written more than 300 publications, holds 15 patents, and has been honored as an IEEE Fellow for his work on power delivery.
A. Ege Engin received his B.S. and M.S. in electrical engineering from Middle East Technical University, Ankara, Turkey, and from the University of Paderborn, Germany. From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration in Berlin. During this time, he also received his Ph.D. from the University of Hannover, Germany. He is currently a research engineer in the School of Electrical and Computer Engineering and an assistant research director of the Packaging Research Center at Georgia Tech. He has more than 50 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.