Power Integrity Modeling and Design for Semiconductors and Systems

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

• Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
• Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
• Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
• Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
• Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Online Sample Chapter

Basic Concepts for Semiconductor Power Delivery

Sample Chapter(s)

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Index

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Preface

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Table of Contents

Preface        xiii
Acknowledgments        xvii
About the Authors        xxi

Chapter 1: Basic Concepts        1

1.1    Introduction        1
1.2    Simple Relationships for Power Delivery        10
1.3    Design of PDNs        17
1.4    Components of a PDN        24
1.5    Analysis of PDNs        45
1.6    Chip-Package Antiresonance: An Example        61
1.7    High-Frequency Measurements        65
1.8    Signal Lines Referenced to Planes        71
1.9    PDN Modeling Methodology        77
1.10  Summary        79

Chapter 2: Modeling of Planes        83

2.1    Introduction        83
2.2    Behavior of Planes        84
2.3    Lumped Modeling Using Partial Inductances        89
2.4    Distributed Circuit-Based Approaches        94
2.5    Discretization-Based Plane Models        117
2.6    Analytical Methods        133
2.7    Multiple Plane Pairs        138
2.8    Summary        169

Chapter 3: Simultaneous Switching Noise        175

3.1    Introduction        175
3.2    Simple Models        177
3.3    Modeling of Transmission Lines and Planes        185
3.4    Application of Models in Time-Domain Analysis        209
3.5    Application of Models in Frequency-Domain Analysis        226
3.6    Extension of M-FDM to Incorporate Transmission Lines        233
3.7    Summary        239

Chapter 4: Time-Domain Simulation Methods        243

4.1    Introduction        243
4.2    Rational Function Method        244
4.3    Signal Flow Graphs        295
4.4    Modified Nodal Analysis (MNA)        317
4.5    Summary 327

Chapter 5: Applications 333

5.1    Introduction        333
5.2    High-Speed Servers        334
5.3    High-Speed Differential Signaling        349
5.4    Analysis of IC Packages        365
5.5    Extraction of Dielectric Constant and Loss Tangent        372
5.6    Embedded Decoupling Capacitors        392
5.7    Electromagnetic Bandgap (EBG) Structures        415
5.8    Future Challenges        443

Appendix A        451

A.1    Multiport Networks        451
A.2    Matrix Representation of Transmission Lines        453
A.3    Spectrum of Digital Signals        454

Appendix B: Software List        459

Index        461