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Power Integrity Analysis and Management for Integrated Circuits
- By Raj Nair, Donald Bennett
- Published May 7, 2010 by Pearson.
Book
- Sorry, this book is no longer in print.
Description
- Copyright 2010
- Edition: 1st
- Book
- ISBN-10: 0-13-701122-9
- ISBN-13: 978-0-13-701122-3
New Techniques and Tools for Ensuring On-Chip Power Integrity—Down to Nanoscale
As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving.
Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free at anasim.com/category/software.
The authors
- Systematically explore power integrity implications, analysis, and management for integrated circuits
- Present practical examples and industry best practices for a broad spectrum of chip design applications
- Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity
- Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling
- Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples
- Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation
Power Integrity Analysis and Management for Integrated Circuits’ coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design—especially those working at the nanoscale level.
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Table of Contents
Preface xv
Acknowledgments xxi
About the Authors xxiii
Contributors xxv
Chapter 1: Power, Delivering Power, and Power Integrity 1
1.1 Electromotive Force (emf) 1
1.2 Electrical Power 5
1.3 Power Delivery 8
1.4 Power Integrity (PI) 13
1.5 Exercises 17
References 18
Chapter 2: Ultra-Large-Scale Integration and Power Challenges 19
2.1 Exponential Integration and Semiconductor Scaling 20
2.2 Power and Energy Consumption 27
2.3 Power, Heat, and Power Integrity Challenges 39
2.4 Exercises 50
References 51
Chapter 3: IC Power Integrity and Optimal Power Delivery 53
3.1 Power Transfer and Efficiency 53
3.2 Optimal IC Power Delivery: On-Chip Inductance and Grid Design 81
3.3 Power Grid Cost Factor Trade-off Analysis and Design 99
3.4 Exercises 106
References 107
Chapter 4: Early Power Integrity Analysis and Abstraction 111
4.1 Process, Voltage, and Temperature: Design Verification Space 112
4.2 Back-End and Front-End PI Analysis 115
4.3 Simulation Environment for Models of High Abstraction Levels 126
4.4 Abstraction and PI Analysis Examples 129
4.5 Summary and Enhancements 135
4.6 Exercises 136
References 138
Chapter 5: Power Integrity Analysis and EMI/EMC 141
5.1 Introduction 141
5.2 Analysis of Noise Generation and Propagation through a Power Distribution Network 143
5.3 Modeling Decoupling Capacitors for Noise Mitigation in PDNs 150
5.4 Current Design Methodology for Power Delivery Networks 154
5.5 Modeling Methodologies 159
5.6 Numerical Methods 169
5.7 Power and Signal Delivery Analysis Tools and Limitations 176
5.8 Power Integrity-Aware Electromagnetic Interference Analysis 188
5.9 Strengths and Limitations of Existing Early EMI methodologies 197
5.10 Early Power Integrity-Aware EMI Modeling and Analysis Flow 198
5.11 SI, PI, and EMI Summary 215
5.12 Exercises 216
References 216
Chapter 6: Power Distribution Modeling and Integrity Analysis 221
6.1 Introduction 221
6.2 Modeling of a Power Distribution Grid 224
6.3 Numerical Analysis of Power Distribution Model 229
6.4 Differential and Common-Mode Noise 230
6.5 Verification and Error Analysis 233
6.6 Modeling of On-Chip Bus Switching Current 239
6.7 Verification of the Bus Model 245
6.8 Bus Skewing to Reduce Power Distribution Noise 248
6.9 Case Study: Reduction of Power Distribution Noise 250
6.10 Exercises 252
6.11 Appendix: Coefficients for Equation (6-37) 253
References 255
Chapter 7: Effective Current Density and Continuum Models 259
7.1 Circuit and Model Simplification 259
7.2 Definition of Effective Current Density 260
7.3 Effective Current Density and Virtual Currents 263
7.4 Symmetry in Networks Containing Conductors, Insulators, and Other Components 263
7.5 A Continuum Model Using ECD 264
7.6 Practical Application of a Continuum-Based Simulator to IC Floorplanning 273
7.7 Continuum Models Compared to SPICE Models 280
7.8 Model Enhancement for Nanoscale CMOS Integrated Circuits 284
7.9 Exercises 285
References 286
Chapter 8: Power Integrity-Aware Chip Floorplanning and Design 287
8.1 Design for Power Integrity: Nanometer Era Considerations 287
8.2 Design for Power Integrity: Techniques 291
8.3 Power Management and Power Integrity 300
References 314
Chapter 9: Power Integrity Management in Integrated Circuits and Systems 317
9.1 Chip-Level PI Management 318
9.2 System- and Package-Level PI Management 331
9.3 Exercises 341
References 343
Additional Reading 346
Chapter 10: Integration Technologies, Trends, and Challenges 347
10.1 Chip-Level Integration 348
10.2 Package-Level Integration 352
10.3 Integration Trend for Power Integrity Management Components 366
References 367
Additional Reading 369
Appendix A: ECD Continuum Model Derivation 371
Appendix B: Derivation of the Helmholtz Equation for Planar Circuits 383
Index 385