Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany. From 2001 to 2004 he was with the Fraunhofer-Institute for Reliability and Microintegration in Berlin. During this time he also received his Ph.D. from the University of Hannover, Germany. He is currently a Research Engineer in the School of Electrical and Computer Engineering and an Assistant Research Director of the Packaging Research Center at Georgia Tech. He has more than 40 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.