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Kyung Suk (Dan) Oh received the B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois, Urbana-Champaign, in 1990, 1992, and 1995, respectively. His doctoral research was in the area of computational electromagnetics applied to transmission line modeling and simulation. He is a Senior Principal Engineer at Rambus Inc. He leads signal integrity analysis for various products including serial, parallel, and memory interfaces. He is also responsible for developing advanced signal and power integrity analysis tools. His current interests include advance signal and power integrity modeling and simulation techniques, optimization of channel designs for various standard or proprietary I/O links, and application of signaling techniques to high-speed digital links.
Dr. Oh has published more than 80 papers and holds 7 issued U.S. patents and 10 pending patent applications in areas of high-speed link design. He received two Best Paper Awards in DesignCon and 2008 Best Paper Award in the IEEE Advanced Packaging journal. Dr. Oh serves on the technical program committee of IEEE EPEPS, and is a former member of the IEC DesignCon Technical Program Committee.