Circuits, Devices andSystems Digital Techniques for High-SpeedDesign
High-speed digitaldesign—Complete, current, and practical
Practicing engineers whowork with high-speed digital designknow that a thorough, fully up-to-date resource is crucial for keeping pacewith rapidly changing technologies. Senior and graduate-level engineeringstudents need a similar resource, but with added introductory material andplenty of exercises. Only one book fills the need of both audiences—Handbookof Digital Techniques for High-Speed Design, by electronics expert TomGranberg.
This practical handbookcovers every aspect of board-level design, starting with the basics of designtrends, SerDes and bus technologies, and signal integrity. In-depth topics includememory technologies, fiber optics, modeling and simulation, design tools andthe design process, CML controlled-impedance drivers, differential andmixed-mode S-parameters, and the emerging protocols and technologies of RapidIOand PCI-Express. Tom Granberg also features major, detailed high-speed designexamples—including a BLVDS SerDes design and a design with highgigabit-per-second serial links using WarpLink devices.
Provides detailed technical information on CML, SSTL, GTL/GTL+/GTLP, LVDS, Bus LVDS, M-LVDS, LVDM, ECL, PECL, LVPECL, HSTL, and more—plus applications best suited for each
Discusses IBIS and SPICE modeling and simulation, plus a full range of electronic design automation (EDA) tools
Emphasizes backplane and bus design with detailed guidelines and design rules
Covers fiber optics in detail—and when it makes sense to use them, and much more!
This book was written withtwo audiences in mind—practicing engineers who work with high-speeddigital electronics, and graduate and undergraduate-level students in collegesand universities who need to learn the concepts and techniques of high-speeddigital design before going to work in industry.
1. Trends in High-Speed Design.
2. ASICs, Backplane Configurations, and SerDes Technology.
3. A Few Basics on Signal Integrity.
II. SIGNALING TECHNOLOGIES AND DEVICES.4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.13. Memory Device Overview and Memory Signaling Technologies.
IV. MODELING, SIMULATION, AND EDA TOOLS.19. Differential and Mixed-Mode SParameters.
V. DESIGN CONCEPTS AND EXAMPLES.23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.
VI. EMERGING PROTOCOLS AND TECHNOLOGIES.28. Electrical Optical Circuit Board (EOCB).
VII. LAB AND TEST INSTRUMENTATION.31. Electrical and Optical Test Equipment.